TIP #056: Watch when BGA settles down
Why? That is the moment when solder has melted down.
TIP #055: Use different footprint for R and C
Why? Recommended land patterns are different. You may also want to use different 3D model for capacitors and different for resistors.
TIP #054: Place reference point of for through hole to pin 1
Why? Easier for documentation, easier for enclosure design.
TIP #053: Create net classes (if your CAD system supports it)
Why? You can then very simply select elements (pins, tracks, polygons, ...) which belong to a particular net class. It’s very useful during layout.
TIP #052: Place output capacitors close to the power
Why? It’s the safe way to do it.
TIP #051: Always create a cover page with list of pages
Why? It’s the professional way to do it. Many people read and use the page numbers – a lot.
TIP #050: Read Errata documents
Why? Most erratas are not important, but there are always a few which may cause you problems.
TIP #049: Place crystals close to the chip, keep the tracks short
Why? Long crystal tracks may prevent the crystal from oscillating – so, crystal may not work.
TIP #048: Import reference schematics
Why? This will save you a lot of time and minimize possible mistakes which could happen when re-drawing the schematic.
TIP #047: Use chips with good software support
Why? It speeds up development process. It may be time consuming to start developing software from scratch, especially if you do not have to.
TIP #046: Check pin ordering of your footprint
Why? This is one of the most common mistakes done during creating a new footprint. It is very hard to fix on already made board.
TIP #045: Create useful folder structure for your projects
Why? Find your files quickly, find your colleagues files quickly, backup the important files, know what files were used for manufacturing